GIGABYTE B760M DS3H AX Motherboard + Intel Core i3-14100 (14th GEN) Processor BUNDLE
GIGABYTE B760M DS3H AX Motherboard + Intel Core i3-14100 (14th GEN) Processor BUNDLE
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Gigabyte B760M DS3H AX (rev. 1.x)
Intel®B760 Chipset
- Supports Intel® Core™ 14th/ 13th /12th processors
- Unparalleled Performance: Hybrid 6+2+1 Phases Digital VRM Solution
- Dual Channel DDR5: 4*DIMMs XMP Memory Module Support
- Next Generation Storage: 2*PCIe 4.0 x4 M.2 Connectors
- M.2 Thermal Guard: To Ensure M.2 SSD Performance
- EZ-Latch: PCIe 4.0x16 Slot with Quick Release Design
- Fast Networks: 2.5GbE LAN & Wi-Fi 6E 802.11ax
- Extended Connectivity: Rear USB-C® 10Gb/s, DP, HDMI
- Smart Fan 6: Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
-
Q-Flash Plus: Update BIOS Without Installing the CPU, Memory and Graphics Card
Intel® Core™ i3-14100
(12M Cache, up to 4.70 GHz)
CPU Specifications
- Total Cores - 4
- # of Performance-cores - 4
- # of Efficient-cores - 0
- Total Threads - 8
- Max Turbo Frequency - 4.7 GHz
- Performance-core Max Turbo Frequency - 4.7 GHz
- Performance-core Base Frequency - 3.5 GHz
- Cache - 12 MB Intel® Smart Cache
- Total L2 Cache - 5 MB
- Processor Base Power - 60 W
- Maximum Turbo Power - 110 W
Memory Specifications
- Max Memory Size (dependent on memory type) - 192 GB
- Memory Types - Up to DDR5 4800 MT/s, Up to DDR4 3200 MT/s
- Max # of Memory Channels - 2
- Max Memory Bandwidth - 76.8 GB/s
GPU Specifications
- GPU Name‡ - Intel® UHD Graphics 730 Graphics
- Max Dynamic Frequency - 1.5 GHz
- Graphics Output - eDP 1.4b, DP 1.4a, HDMI 2.1
- Execution Units - 24
- Max Resolution (HDMI)‡ - 4096 x 2160 @ 60Hz
- Max Resolution (DP)‡ - 7680 x 4320 @ 60Hz
- Max Resolution (eDP - Integrated Flat Panel)‡ - 5120 x 3200 @ 120Hz
- DirectX* Support - 12
- OpenGL* Support - 4.5
- OpenCL* Support - 3.0
- Multi-Format Codec Engines - 1
- Intel® Quick Sync Video - Yes
- Intel® Clear Video HD Technology - Yes
- # of Displays Supported ‡- 4
- Device - ID0x4692
Expansion Options
- Direct Media Interface (DMI) Revision - 4.0
- Max # of DMI Lanes - 8
- Scalability - 1S Only
- PCI Express Revision - 5.0 and 4.0
- PCI Express Configurations ‡ - Up to 1x16+4, 2x8+4
- Max # of PCI Express Lanes - 20
Package Specifications
- Sockets Supported - FCLGA1700
- Max CPU Configuration - 1
- Thermal Solution Specification - PCG 2020C
- TJUNCTION - 100 °C
- Package Size - 45.0 mm x 37.5 mm
- Max Operating Temperature - 100 °C
Advanced Technologies
- Intel® Volume Management Device (VMD) - Yes
- Intel® Gaussian & Neural Accelerator - 3.0
- Intel® Deep Learning Boost (Intel® DL Boost) on CPU - Yes
- Intel® Speed Shift Technology - Yes
- Intel® Turbo Boost Technology ‡ - 2.0
- Intel® Hyper-Threading Technology ‡ - Yes
- Intel® 64 ‡ - Yes
- Instruction Set - 64-bit
- Instruction Set Extensions - Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
- Idle States Yes Enhanced Intel SpeedStep® Technology - Yes
- Thermal Monitoring Technologies - Yes
Security & Reliability
- Intel® Standard Manageability (ISM) ‡ - Yes
- Intel® Control-Flow Enforcement Technology - Yes
- Intel® AES New Instructions - Yes
- Secure Key - Yes
- Intel® OS Guard - Yes
- Execute Disable Bit ‡ - Yes
- Intel® Boot Guard - Yes
- Mode-based Execute Control (MBEC) - Yes
- Intel® Virtualization Technology (VT-x) ‡ - Yes
- Intel® Virtualization Technology for Directed I/O (VT-d) ‡ - Yes
- Intel® VT-x with Extended Page Tables (EPT) ‡ - Yes