BUNDLE Gigabyte B760M DS3H AX, Dual Channel DDR5, M.2 Thermal Guard + INTEL Core i7 14700F 16 Cores / 24 Threads 5.4GHz LGA1700 Processor
BUNDLE Gigabyte B760M DS3H AX, Dual Channel DDR5, M.2 Thermal Guard + INTEL Core i7 14700F 16 Cores / 24 Threads 5.4GHz LGA1700 Processor
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$778.00 SGD
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Gigabyte B760M DS3H AX
- Supports Intel® Core™ 14th/ 13th /12th processors
- Unparalleled Performance:Hybrid 6+2+1 Phases Digital VRM Solution
- Dual Channel DDR5:4*DIMMs XMP Memory Module Support
- Next Generation Storage:2*PCIe 4.0 x4 M.2 Connectors
- M.2 Thermal Guard:To Ensure M.2 SSD Performance
- EZ-Latch:PCIe 4.0x16 Slot with Quick Release Design
- Fast Networks:2.5GbE LAN & Wi-Fi 6E 802.11ax
- Extended Connectivity:Rear USB-C® 10Gb/s, DP, HDMI
- Smart Fan 6:Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
- Q-Flash Plus:Update BIOS Without Installing the CPU, Memory and Graphics Card
INTEL Core i7 14700F 16 Cores / 24 Threads 5.4GHz LGA1700 Processor
Essentials
Product Collection
Code Name
Vertical Segment
Desktop
Processor Number
i7-14700F
Lithography
Intel 7
Recommended Customer Price
$359.00-$369.00
CPU Specifications
Total Cores
20
# of Performance-cores
8
# of Efficient-cores
12
Total Threads
28
Max Turbo Frequency
5.4 GHz
Intel® Turbo Boost Max Technology 3.0 Frequency ‡
5.4 GHz
Performance-core Max Turbo Frequency
5.3 GHz
Efficient-core Max Turbo Frequency
4.2 GHz
Performance-core Base Frequency
2.1 GHz
Efficient-core Base Frequency
1.5 GHz
Cache
33 MB Intel® Smart Cache
Total L2 Cache
28 MB
Processor Base Power
65 W
Maximum Turbo Power
219 W
Supplemental Information
Marketing Status
Launched
Launch Date
Q1'24
Embedded Options Available
No
Use Conditions
PC/Client/Tablet
Memory Specifications
Max Memory Size (dependent on memory type)
192 GB
Memory Types
Up to DDR5 5600 MT/s
Up to DDR4 3200 MT/s
Up to DDR4 3200 MT/s
Max # of Memory Channels
2
Max Memory Bandwidth
89.6 GB/s
Expansion Options
Direct Media Interface (DMI) Revision
4.0
Max # of DMI Lanes
8
Scalability
1S Only
PCI Express Revision
5.0 and 4.0
PCI Express Configurations ‡
Up to 1x16+4, 2x8+4
Max # of PCI Express Lanes
20
Package Specifications
Sockets Supported
FCLGA1700
Max CPU Configuration
1
Thermal Solution Specification
PCG 2020C
TJUNCTION
100°C
Package Size
45.0 mm x 37.5 mm
Max Operating Temperature
100 °C
Advanced Technologies
Intel® Gaussian & Neural Accelerator
3.0
Intel® Thread Director
Yes
Intel® Deep Learning Boost (Intel® DL Boost) on CPU
Yes
Intel® Speed Shift Technology
Yes
Intel® Turbo Boost Max Technology 3.0 ‡
Yes
Intel® Turbo Boost Technology ‡
2.0
Intel® Hyper-Threading Technology ‡
Yes
Intel® 64 ‡
Yes
Instruction Set
64-bit
Instruction Set Extensions
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Idle States
Yes
Enhanced Intel SpeedStep® Technology
Yes
Thermal Monitoring Technologies
Yes
Intel® Volume Management Device (VMD)
Yes
Security & Reliability
Intel® Standard Manageability (ISM) ‡
Yes
Intel® Control-Flow Enforcement Technology
Yes
Intel® AES New Instructions
Yes
Secure Key
Yes
Intel® OS Guard
Yes
Execute Disable Bit ‡
Yes
Intel® Boot Guard
Yes
Mode-based Execute Control (MBEC)
Yes
Intel® Virtualization Technology (VT-x) ‡
Yes
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Yes
Intel® VT-x with Extended Page Tables (EPT) ‡